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Classification of FPC flexible circuit board

Author:Luwis Date:2/6/2018 10:28:25 PM
 At present, the flexible printed circuit mainly has the single side, two sides, the multi-layer and the rigid flexible circuit board four kinds.
The single-sided flexible board is the lowest cost, when the power demand is not high.In the single - sided wiring, the single - sided flexible plate should be used.It has a layer of chemically etched conductive pattern, and the conductive graphic layer on the flexible insulating substrate is pressed copper foil.The insulating substrate can be polyimide, polyethylene terephthalate, aromatic amide fiber ester and polyvinyl chloride.
The two-sided flexible plate is a conductive pattern made by etching on both sides of the insulating base film.The metallized hole forms a conductive path to the two sides of the insulating material to meet the flexural design and function.The mulch can protect the single, double-sided conductor and indicate the position of the element.
The multi-layer flexible plate is a layer of single or two-sided flexible circuit layer which can be pressed together, and the conductive path is formed between different layers by drilling the hole and forming the metallization hole.In this way, no complicated welding process is required.Multilayer circuits have great functional differences in higher reliability, better thermal conductivity and more convenient assembly performance.When designing the layout, the interaction between the size, number of layers and the flexibility should be taken into account.
The traditional rigid flexible plate is composed of rigid and flexible base plates.The structure is close, and the conductive connection is formed by metallization of the outer L.If a printing plate is both positive and negative, the rigid flexible plate is a good choice.But if all the components are on one side, double-sided flexible plates are selected and a FR4 reinforced material is pressed on the back layer to make it more economical.
The flexible circuit board of mixed structure is a kind of multilayer board, the conductive layer is composed of different metals.An 8-floor board USES fr-4 as the medium of the inner layer, using polyimide as the outer medium, extending the lead from three different directions of the motherboard, each of which is made of different metals.Copper alloys, copper and gold are independent leads.This hybrid structure is the only feasible solution in the case of the relationship between electrical signal conversion and heat transfer and the low temperature.
It can be evaluated by the convenience and total cost of internal design to achieve the best performance ratio.

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