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FPC hole metallization

Author:Luwis zeng Date:5/25/2018 1:15:14 AM
 FPC hole metallization SHADOW black shadow process, black shadow method has a horizontal and vertical production methods, but because of the vertical production method of a longer production time, less horizontal production is simple, so strongly recommended horizontal transfer mode of production, in order to Replace the traditional sink copper process. The shadow method is the most important use of graphite as a conductive object. Due to the large amount of free electrons in the graphite molecular structure, the electrical conductivity of graphite is higher than that of carbon black. The electroplating rate is proportional to the conductivity of the coating, so the higher the conductivity of the coating, the faster the plating rate.
    The three different processes of SHADOW and Blackhole are: 1) Blackhole has to go twice, SHADOW only once; 2) SHADOW has a patented Fixer; 3) SHADOW uses GRAPHITE as conductive material, and BLACKHOLE uses it. Carbon Black; Due to the above differences, it can be considered: 1) Why do you have to pass BLACKHOLE twice instead of once? Early BLACKHOLE was also adopted once and later changed to twice. 2) SHADOW uses a fixer to control the thickness of the graphite deposited on the HOLEWALL, while BLACKHOLE uses an air knife (AIR KNIFE) to control the thickness of the carbon deposited on the walls of the hole, both of which are not distinguishable from the light; 3) Carbon black and graphite conductivity The difference in degree is obvious; when the thickness of carbon black deposited on the wall of the hole is too thick, it will lead to separation of the hole wall, leading to reliability of the hole wall. Especially when MulTIlayer is used, the problem is even worse.
    The carbon crystal structure is SP3, and the graphite crystal structure is SP2, so graphite has more free p electrons, and the natural electrical conductivity is better. Of course, in the ParTIcle Size, SHADOW is indeed larger than BLACKHOLE, BLACKHOLE is 50-100 nm, SHADOW is 0.6um, but graphite is flaky crystal, 0.6um is its width dimension, its thickness is 1/15 of the width, which is 0.04um; So SHADOW achieves good coverage in HOLEWALL coverage. In addition, BLACKHOLE is a solution, SHADOW COLLOID is a colloid, and the latter is more tolerant to copper ion pollution. The former is more sensitive to copper ions and other positively charged ions, so the BLACKHOLEParTIcle Size easily exceeds 100 nm, and the process is difficult to control at this time.
    Black Shadow Process Chemicals:
    (1) Cleaner/CondiTIoner
    The cleaning/adjusting agent is a kind of slightly alkaline liquid. The main function is to clean the surface of the hole wall and to adjust the glass fiber and the epoxy resin surface as a kind of sizing agent.
    (2) Conductive Colloid
    The shadowing agent is a slightly alkaline liquid containing a unique additive and a conductive gel-like substance that forms a conductive layer on the walls of the pores.
    (3) Fixer
    The excess shadow agent on the wall of the hole is removed so that the black conductive layer can be evenly distributed on the wall of the hole.
    (4) Micro-Etch
    The main components of the microetching agent are sodium persulfate and sulfuric acid. The main role of the micro-etching agent is to remove the black shadow on the copper surface through the side etching. Since resins and glass fibers are inert, the micro-etching cannot remove dark shadows on the sheet.
    (5) Anti-Tarnish
    Antioxidant is a slightly acidic liquid used to protect the copper surface from

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