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Flexible circuit board hot air leveling

Author: Date:7/27/2018 10:40:13 AM
 The hot air plain is a technology developed for the coating of lead-tin on rigid printed circuit boards. Due to the simplicity of this technology, it is also applied to flexible printed board FPC. The hot air leveling is to immerse the board directly in the molten lead-slot, and the excess solder is blown off by hot air. This condition is very demanding for the flexible printed board FPC. If the flexible printed board FPC cannot be immersed in the solder without any measures, the flexible printed board FPC must be clamped to the middle of the screen made of titanium steel. Then, it is immersed in the molten solder. Of course, the surface of the flexible printed board FPC is also cleaned and coated with flux.

Due to the harsh hot air leveling process conditions, it is easy for the solder to be drilled from the end of the cover layer to the underside of the cover layer, especially when the bond strength between the cover layer and the copper foil surface is low, and this phenomenon is more likely to occur frequently. Since the polyimide film is easy to absorb moisture, when the hot air leveling process is used, the moisture absorbing moisture may cause foaming or even peeling of the cover layer due to rapid heat evaporation, so the coating line is recommended to be carried out before the FPC hot air leveling is performed. Dry treatment and moisture management.

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